Yunimec "Diatatch Agent"
Introduction of the registered trademark "Unimec" heat-curing conductive materials.
"Dia Attach Agent" is a thermosetting conductive material that is versatile for various applications, including die bonding for bare chips, adhesion of LEDs, and bonding of electrodes and lead wires, as well as for high thermal conductivity. Our trademark "Unimec" is a conductive material that can be treated at low temperatures, made from a thermosetting resin primarily based on epoxy resin, with specially processed in-house conductive powder uniformly dispersed throughout. The development and blending of conductive powders enable the manufacture of products with various characteristics. [Features] ■ Versatile applications ■ Thermosetting conductive material ■ Can be treated at low temperatures *For more details, please refer to the PDF document or feel free to contact us.
- Company：ナミックス
- Price：Other
